Shenzhen Hong Ye Jie Technology Co., Ltd.
Main products:Mold silicone rubber, Manual mold silicone rubber, Pad printing silicone rubber, Addition cure liquid silicone, Injection silicone, Electronic potting silicone
Products
Contact Us
  • Contact Person : Ms. Wu Alice
  • Company Name : Shenzhen Hong Ye Jie Technology Co., Ltd.
  • Tel : 86-755-89948013
  • Fax : 86-755-89756930
  • Address : Guangdong,Shenzhen,Liulian Shibi Industrial Zone, Pingdi Town, Longgang District,Shenzhen
  • Country/Region : China
  • Zip : 518117

Silicone Encapsulants and potting compounds for Printed Circuit Board

Silicone Encapsulants and potting compounds for Printed Circuit Board
Product Detailed
Electronic Potting Silicone Rubber can be vulcanized under room/high temperature, low viscosity, easy mixing and pouring.

Silicone Encapsulants and potting compounds for Printed Circuit Board Applications & Features:

It can be vulcanized under room temperature or high temperature with low viscosity, easy mixing and pouring, and it is applicable to bulk pouring with excellent electrical performance. It is applicable to sealing, bonding, coating for electronic parts.

                                         

Silicone Encapsulants and potting compounds for Printed Circuit Board Applications & Features:

It serves sticky viscosity, low shrinkage and non-corrosiveness. It can be used for a long time under the temperature of -60~200C with the characteristics of moisture-proof and waterproof, radiation-proof, as well as weatherable and anti-ageing. It is applicable to sealing, bonding and coating for electronic parts.

 

Silicone Encapsulants and potting compounds for Printed Circuit Board Parameters:

Model

9055#

9301#

Grade

General Purpose

Gelatin

Components

A

B

A

B

Color

Grey

White

Black

Transparent

Mixing Ratio

1

1

1

1

Viscosity Pa.s

2.5+/-0.5

2.5+/-0.5

2.5+/-0.5

2.5+/-0.5

Pot Life(Min/25°C)

60-90

300

Curing Time(Min)

25°C/180 or 80°C/20

 80°C/30

Hardness(Shore A)

55+/-5

0

Dielectric Strength (kv/mm)

≥25

≥25

Elongation Break(%)

-

-

Volume Resistance(Ω)

≥1.0X1015

≥1.0X1015

Dielectric Constant(1.2mhz)

3.0-3.3

3

Voltage Resistance(KV.MM-1)

-

-

Temperature Resistance(°C)

-60 ~200

-60 ~200

Flame Retardant

UL94-V1

UL94-V1

 

Any questions of Silicone Encapsulants and potting compounds for Printed Circuit Board, please feel free to contact Aaron: 

TEL: 086-755-89948006

FAX: 086-755-89948030

MOBILE:086-13622300503 

Silicone Encapsulants and potting compounds for Printed Circuit Board



Copyright Notice @ 2008-2012 ECVERY Limited and/or its subsidiaries and licensors. All rights reserved.